Technical and Product Bulletins Below is a list of product and technical bulletins available for download in PDF format.
Thermal Management Solutions Thermal Management Materials for Photonics and Electronic Packaging (TB-500-A) CTE-Matched Microchannel Coolers (TB-800-B) High Power Laser Diodes and RF Circuits (PB-700-A) Tungston-Copper Wafers Lithography Grade (PB-701-A) Low Expansion Material for Thermal Management (PB-500-A) Electronic Packaging Materials Molybdenum-Copper (PB-600-A) Optical Platforms & Optoelectronic Packaging (PB-601-A)
Dispenser Cathodes Review Articles (TB-104-B) Dispenser Cathode (TB-105-B) Handling and Activation of Dispenser Cathodes (TB-106-C) Emission Suppression(TB-109-B) Emission Characteristics of Coated Cathodes (TB-117-C) Guidelines for Dispenser Cathode Activation (TB-147-C) Filament Power Supply Recommendation (TB-200-A) Directly Heated Filament Cathode (PB-200-B)
Tungsten Alloys (PB being updated)
Porous Refractory Metals Porous Refractory Metals Tungsten and Molybdenum (PB-800-C)