A QUALIFIED SOURCE FOR REFRACTORY THERMAL COMPOSITES
Spectra-Mat manufactures engineered tungsten copper (WCu) and molybdenum copper (MoCu) composites via a proprietary powder metallurgy process — designed for the most demanding thermal applications in RF/microwave, laser diode and semiconductor packaging.
Standard and custom compositions, full in-house machining and plating, and direct engineering support for build-to-print components.
Request a Quote Explore MaterialsTWO MATERIALS, ONE PROCESS
Refractory metal composites produced via proprietary powder metallurgy. Same in-house process, different material set, tunable for your specific application.
WCu
TUNGSTENCOPPER
High-density tungsten-copper composites optimized for low thermal expansion and high thermal conductivity. Ideal for applications where dimensional stability and CTE matching to ceramic substrates are critical.
Standard Compositions
Typical Applications
- RF & microwave packages
- GaN / GaAs thermal bases
- MMIC packaging
- Heat sinks for high-power devices
MoCu
MOLYBDENUMCOPPER
Molybdenum-copper composites with tunable CTE and thermal conductivity. Mo85/Cu15 is widely used in RF packages where CTE matching to specific substrate materials is essential.
Standard Compositions
Typical Applications
- RF packaging
- Semiconductor packaging
- Heat spreaders for power devices
- Power electronics
APPLICATION CLUSTERS
Three application domains where WCu and MoCu refractory composites are mission-critical. Each cluster supports its own Google Ads ad group and anchor URL for direct deep-linking.
RF & Microwave
Thermal bases and heat spreaders for GaN, GaAs and MMIC packages. The workhorse cluster — Mo85/Cu15 widely used in high-frequency power applications where CTE matching to substrate materials is essential.
Laser Diode
Submounts and spacers for high-power laser diode applications. Tight machining tolerances and CTE matching to laser substrates — gold-plated surfaces where optical-grade finish is required.
Semiconductor Packaging
Heat spreaders and thermal bases for power devices and discrete semiconductor packaging. Mo70/Cu30 and Mo85/Cu15 compositions tuned for power electronics where thermal management is critical to device reliability.
TECHNICAL SPECIFICATIONS
Key parameters for design engineers — to be populated with validated values.
| Material | Composition | CTE (ppm/K) | Thermal Cond. (W/m·K) | Density (g/cm³) |
|---|---|---|---|---|
| WCu | W90/Cu10 | [TO BE VALIDATED] | [TO BE VALIDATED] | [TO BE VALIDATED] |
| WCu | W85/Cu15 | [TO BE VALIDATED] | [TO BE VALIDATED] | [TO BE VALIDATED] |
| MoCu | Mo85/Cu15 ★ | [TO BE VALIDATED] | [TO BE VALIDATED] | [TO BE VALIDATED] |
| MoCu | Mo70/Cu30 | [TO BE VALIDATED] | [TO BE VALIDATED] | [TO BE VALIDATED] |
01
Powder Metallurgy
Proprietary process producing void-free, uniform composites with repeatable performance.
02
In-house Machining
Precision machining to tight tolerances — your geometry, our process.
03
Plating & Finishing
Ni/Au, Ni/Ag and custom plating options for solderability and corrosion resistance.
04
SAES Group
Full vertical integration under one roof, part of a global advanced materials group.
REQUEST A QUOTE OR TECHNICAL REVIEW
Share your specification, drawing or application requirements — our application engineering team will respond with a Spectra-Mat proposal.
